Thermal Conductivity Apparatus (SMT-HT-141)

This apparatus is designed to measure the thermal conductivity and thermal resistance of various building and insulating materials, providing essential data for evaluating energy efficiency in construction and industrial applications. It allows for the precise determination of how effectively different materials resist heat flow, which is critical for improving thermal insulation. The unit operates on the guarded hot plate principle, where a sample is placed between a hot and a cold plate to create a steady-state temperature gradient. It features two heat flux sensors and six temperature sensors to accurately measure the heat flow and temperature distribution across the sample. A loading system ensures consistent pressure on the specimens, and the entire process is controlled and monitored via a touchscreen LCD interface with data acquisition software that logs and analyzes the results. Its primary applications are in materials science and civil engineering education, as well as in quality control for insulation manufacturing. The key benefit is its ability to provide reliable, standardized measurements of thermal properties, enabling students and researchers to compare material performance, verify compliance with building codes, and contribute to the development of more energy-efficient designs.